Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications - Archive ouverte HAL Access content directly
Conference Papers Year :

Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications

presentation.pdf (5.22 Mo) Télécharger le fichier
Origin : Files produced by the author(s)

Dates and versions

hal-01935060 , version 1 (26-11-2018)

Identifiers

  • HAL Id : hal-01935060 , version 1

Cite

Aymen Ben Kabaar, Cyril Buttay, Olivier Dezellus, Rafael Estevez, Anthony Gravouil, et al.. Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications. ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany. ⟨hal-01935060⟩
75 View
100 Download

Share

Gmail Facebook Twitter LinkedIn More