Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications - Archive ouverte HAL
Communication Dans Un Congrès Année : 2018

Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications

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hal-01935060 , version 1 (26-11-2018)

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  • HAL Id : hal-01935060 , version 1

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Aymen Ben Kabaar, Cyril Buttay, Olivier Dezellus, Rafael Estevez, Anthony Gravouil, et al.. Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications. ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany. ⟨hal-01935060⟩
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