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Communication Dans Un Congrès Année : 2024

Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader

Résumé

A graphite heat spreader designed to be compatible with printed circuit board (PCB) embedding technology is demonstrated. It is suited to wide-bandgap devices and high-power loss density requirements (> 500 W/cm²). PCB samples integrating a graphite heat spreader stack are designed and fabricated then compared to a reference sample, through both simulation and experimental analysis. It is found that the graphite spreader reduces thermal resistance by up to 38 %, while increasing thermal coupling between adjacent chips by 3-fold.
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Dates et versions

hal-04534372 , version 1 (05-04-2024)

Identifiants

  • HAL Id : hal-04534372 , version 1

Citer

Ahmed Sabry Eltaher Ahmed, Bahaeddine Ben Hamed, Rémi Perrin, Guillaume Regnat, Guillaume Lefevre, et al.. Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader. Conference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany. ⟨hal-04534372⟩
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