Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader
Résumé
A graphite heat spreader designed to be compatible with printed circuit board (PCB) embedding technology is demonstrated. It is suited to wide-bandgap devices and high-power loss density requirements (> 500 W/cm²). PCB samples integrating a graphite heat spreader stack are designed and fabricated then compared to a reference sample, through both simulation and experimental analysis. It is found that the graphite spreader reduces thermal resistance by up to 38 %, while increasing thermal coupling between adjacent chips by 3-fold.
Domaines
Energie électrique| Origine | Fichiers produits par l'(les) auteur(s) |
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