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Conference Papers Year : 2020

Glass Substrate Interposer for TSV-integrated Surface Electrode Ion Trap

Peng Zhao
Hong Yu Li
  • Function : Author
Yu Dian Lim
  • Function : Author
Jing Tao
Chuan Seng Tan

Abstract

Confined by a combination of RF and DC electrical field, trapped ions are well isolated to retain their quantum properties, and laser addressing is used to perform computation and readout [1]. As a promising candidate for quantum computation, ion traps have been developed from mechanically assembled Paul trap to lithography-defined surface electrode ion trap over past two decades. To further boost its computation capability, numerous ions (~100 ions, intermediate scale) should be trapped and entangled simultaneously, which requires the coherent control from thousands of co-planar RF and DC electrodes. This remains a challenge for conventional wire bonding due to the lack of complex signal-feedthrough capability. To resolve this issue, TSVs are integrated into surface electrode ion trap design. At the same time, interposer with redistribution (RDL) layer is introduced for TSV landing. As a result, the CPGA-RDL signal transmission via TSVs can be achieved with much higher flexibility and scalability than wire bonding.
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Dates and versions

hal-03454671 , version 1 (29-11-2021)

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Cite

Peng Zhao, Hong Yu Li, Yu Dian Lim, Jing Tao, Luca Guidoni, et al.. Glass Substrate Interposer for TSV-integrated Surface Electrode Ion Trap. 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Dec 2020, Singapore, Singapore. pp.262-265, ⟨10.1109/EPTC50525.2020.9315003⟩. ⟨hal-03454671⟩
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