Confined by a combination of RF and DC electrical field, trapped ions are well isolated to retain their quantum properties, and laser addressing is used to perform computation and readout [1]. As a promising candidate for quantum computation, ion traps have been developed from mechanically assembled Paul trap to lithography-defined surface electrode ion trap over past two decades. To further boost its computation capability, numerous ions (~100 ions, intermediate scale) should be trapped and entangled simultaneously, which requires the coherent control from thousands of co-planar RF and DC electrodes. This remains a challenge for conventional wire bonding due to the lack of complex signal-feedthrough capability. To resolve this issue, TSVs are integrated into surface electrode ion trap design. At the same time, interposer with redistribution (RDL) layer is introduced for TSV landing. As a result, the CPGA-RDL signal transmission via TSVs can be achieved with much higher flexibility and scalability than wire bonding.