EDT for Power Devices - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2016

EDT for Power Devices

Résumé

This presentation gives an overview of the packaging requirements for power electronics, especially in terms of thermal aspects. Then, it briefly describes the state-of-the-art in the topic of advanced Printed-Circuit-Board (PCB) use in power electronics. Finally, the embedding technology developed in the 3DPHI platform is presented
presentation.pdf (7.19 Mo) Télécharger le fichier
Origine Fichiers produits par l'(les) auteur(s)

Dates et versions

hal-01373062 , version 1 (28-09-2016)

Identifiants

  • HAL Id : hal-01373062 , version 1

Citer

Cyril Buttay, Chenjiang Yu, Eric Labouré, Vincent Bley, Céline Combettes. EDT for Power Devices. Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom. ⟨hal-01373062⟩
172 Consultations
108 Téléchargements

Partager

Gmail Mastodon Facebook X LinkedIn More