EDT for Power Devices
Résumé
This presentation gives an overview of the packaging requirements for power electronics, especially in terms of thermal aspects. Then, it briefly describes the state-of-the-art in the topic of advanced Printed-Circuit-Board (PCB) use in power electronics. Finally, the embedding technology developed in the 3DPHI platform is presented
Domaines
Sciences de l'ingénieur [physics]| Origine | Fichiers produits par l'(les) auteur(s) |
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