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Communication Dans Un Congrès Année : 2015

Silver sintering for power electronics integration

Résumé

Silver sintering is an attractive alternative to soldering in power electronics, as it offers higher electrical and thermal performance. Furthermore, sintered attaches can operate at a higher temperature. In this paper, we investigate the use of silver sintering for the bonding of passive components, and for the manufacturing of so-called 3D-modules. It is shown that this technique is well suited, as it makes it possible to operate at very high temperature (up to 310 °C demonstrated), and as it simplifies the assembly process (several identical sintering steps can be performed successively without problem).
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Dates et versions

hal-01196525 , version 1 (10-09-2015)

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Cyril Buttay, Bruno Allard, Raphaël Riva. Silver sintering for power electronics integration. ICEP- IAAC, IMAPS, Apr 2015, Kyoto, Japan. ⟨10.1109/ICEP-IAAC.2015.7111076⟩. ⟨hal-01196525⟩
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