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Conference Papers Year : 2010

Femtosecond Bessel filaments for high aspect-ratio and taper-free micromachining of dielectrics

Abstract

Femtosecond Bessel beams are demonstrated for high aspect ratio machining in the filamentation regime with water assistance. Taper-free microchannels and micro-trenches are demonstrated with aspect ratio up to 40 and diameters down to 2 µm.
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hal-00589625 , version 1 (23-04-2021)

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F. Courvoisier, M.K. Bhuyan, M. Jacquot, P.-A. Lacourt, L. Furfaro, et al.. Femtosecond Bessel filaments for high aspect-ratio and taper-free micromachining of dielectrics. Conference on Lasers and Electro-Optics (CLEO) 2010, May 2010, San Jose, United States. ⟨10.1364/CLEO.2010.CMBB3⟩. ⟨hal-00589625⟩
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