Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking - FMNT - Fédération Micro- et Nano- Technologies
Communication Dans Un Congrès Année : 2009

Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking

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hal-00602866 , version 1 (23-06-2011)

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  • HAL Id : hal-00602866 , version 1

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E. Eid, T. Lacrevaz, S. de Rivaz, C. Bermond, B. Fléchet, et al.. Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking. Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking, Sep 2009, San Francisco, United States. ⟨hal-00602866⟩
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