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Impact of hot carrier stress on small signal MOSFET RF parameters
L. Negre
,
Daniel Roy
,
S. Boret
,
P. Scheer
,
N. Kauffmann
et al.
IEEE Integrated Reliability Workshop IRW 2010, 2010, Lake Tahoe, United States
Conference papers
hal-00604565v1
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Profile control and sidewall modifications of narrow porous ULK trenches after plasma etching and pore sealing treatments
Maxime Darnon
,
Thierry Chevolleau
,
D. Eon
,
Fanny Bailly
,
Bernard Pélissier
et al.
53rd International AVS Symposium, 2006, San Francisco, United States
Conference papers
hal-00400479v1
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Residue growth on metallic-hard mask after dielectric etching in fluorocarbon-based plasmas. I. Mechanisms
N. Posseme
,
T. Chevolleau
,
R. Bouyssou
,
T. David
,
V. Arnal
et al.
Journal of Vacuum Science and Technology, 2010, pp.B 28, 809
Journal articles
hal-00647504v1
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Patterning of silicon nitride for CMOS gate spacer technology. I. Mechanisms involved in the silicon consumption in CH3F/O2/He high density plasmas
R. Blanc
,
F. Leverd
,
T. David
,
O. Joubert
Journal articles
hal-00968781v1
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Reduction of Oxygen Content in Thin PVD-TiN Film and Improvement of Electrical Characteristics by Covering it with PEALD-TaCN
F. Piallat
,
R. Gassilloud
,
P. Caubet
,
B. Pelissier
,
Cédric Leroux
et al.
2013 MRS Spring Meeting, 2013, San Francisco, United States
Conference papers
hal-00908484v1
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Modeling the Independent Double Gate Transistor in Accumulation Regime for 1TDRAM Application
V. Puget
,
G. Bossu
,
P. Masson
,
P. Mazoyer
,
R. Ranica
et al.
IEEE Transactions on Electron Devices, 2010, 57 (4), pp.855-865
Journal articles
hal-00596201v1
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Role of H2 plasma in PE-MOCVD of GeTe materials for Phase Change Memory Applications
L. Dussault
,
Corentin Vallée
,
E. Gourvest
,
D. Jourde
,
S. Maitrejean
et al.
MAM 2012, Mar 2012, Grenoble, France
Conference papers
hal-00669530v1
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Plasma treatments to improve Linewidth roughness during gate patterning
L. Azarnouche
,
E. Pargon
,
K. Menguelti
,
M. Fouchier
,
M. Brihoum
et al.
Proceedings of SPIE, the International Society for Optical Engineering, 2012, Vol. 8328, 83280H, 11pp
Journal articles
hal-00808681v1
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Characterization of Plasma-Induced Damages on low-k during Interconnection Integration by Scatterometric Porosimetry
R. Hurand
,
Maxime Darnon
,
T. Chevolleau
,
D. Fuard
,
F. Bailly
et al.
AVS 58h international symposium, Oct 2011, Nashville, United States
Conference papers
hal-00647640v1
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Study of 193-nm resist degradation under various etch chemistries
Arnaud Bazin
,
Michael May
,
Erwine Pargon
,
Benedicte Mortini
,
Olivier Joubert
et al.
SPIE Advances in Resist Materials and Processing Technology, 2007, San Jose, United States. ⟨10.1117/12.711415⟩
Conference papers
hal-00384232v1
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MIM capacitors based on Yttrium oxide – Lanthanum aluminate stacks
Myrtil L. Kahn
,
Corentin Vallée
,
C. Dubourdieu
,
C. Durand
,
S. Blonkowski
et al.
Workshop "Nouveaux oxydes à forte permittivité..", 2005, Autrans, France
Conference papers
hal-00486162v1
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Performance predictions of interconnect networks for advanced technology nodes
M. Gallitre
,
A. Farcy
,
B. Blampey
,
C. Bermond
,
B. Fléchet
et al.
Journal articles
hal-00602047v1
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Etude d'une méthodologie de caractérisation de filtres CRF à grande échelle
W. Sahyoun
,
J.-M. Duchamp
,
N. Corrao
,
Ph. Benech
,
G. Parat
et al.
Etude d'une méthodologie de caractérisation de filtres CRF à grande échelle, May 2009, Grenoble, France
Conference papers
hal-00603024v1
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Critical failure ORC: Improving model accuracy through enhanced model generation
A. Borjon
,
J. Belledent
,
Y. Trouiller
,
K. Patterson
,
K. Lucas
et al.
Journal articles
istex
hal-00023226v1
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Scatterometric Porosimetry for porous low-k patterns characterization
R. Hurand
,
R. Bouyssou
,
Maxime Darnon
,
C. Tiphine
,
C. Licitra
et al.
Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM), May 2011, Dresde, Germany
Conference papers
hal-00647417v1
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Gate-last integration on planar FDSOI for low-VTp and low-EOT MOSFETs
S. Morvan
,
F. Andrieu
,
Cédric Leroux
,
X. Garros
,
M. Casse
et al.
Journal articles
hal-00996453v1
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Materials and processes for non-volatile resistive memories
C. Vallee
,
P. Gonon
,
C. Mannequin
,
E. Gourvest
,
L. Dussault
et al.
MAM 2012, Mar 2012, Grenoble, France
Conference papers
hal-00669444v1
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Plasma etching of HfO2 at elevated temperatures in chlorine-based chemistry
M. Helot
,
Thierry Chevolleau
,
L. Vallier
,
O. Joubert
,
Elisabeth Blanquet
et al.
Journal articles
hal-00397060v1
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Etching Process Scalability and Challenges for ULK Materials
T. Chevolleau
,
N. Posseme
,
T. David
,
R. Bouyssou
,
J. Ducote
et al.
Conference papers
hal-00625314v1
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Statistics of electrical breakdown in high-K materials from millimeter to nanometer length scales: macroscopic testing vs. conductive-AFM
C. Sire
,
S. Blonkowski
,
M. Gordon
,
T. Baron
MRS Fall Meeting, Nov 2007, Boston, United States
Conference papers
hal-00396816v1
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SrTiO3/Y2O3 bilayered dielectrics for MIM capacitor elaboration with improved electrical properties
Myrtil L. Kahn
,
Corentin Vallée
,
E. Defay
,
M. Bonvalot
,
C. Dubourdieu
et al.
Workshop on Dielectrics in Microelectronics WoDiM, 2006, Italy
Conference papers
hal-00390510v1
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Impact on wafer to wafer repeatability of cleaning/coating strategies in a 300mm ICP plasma reactor
L. Babaud
,
P. Gouraud
,
O. Joubert
,
E. Pargon
55th International AVS Symposium & Topical Conferences, Oct 2008, boston, United States
Conference papers
hal-00400652v1
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Resolving contact conflict for double patterning split
N. Zeggaoui
,
V. Farys
,
Y. Troullier
,
E. Yesilada
,
F. Robert
et al.
BACUS conference, 2009, Monterey USA, United States
Conference papers
hal-00461055v1
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Analysis of the diffraction pattern for optimal assist feature placement
A. Borjon
,
J. Belledent
,
Y. Trouiller
,
C. Gardin
,
C. Couderc
et al.
Journal articles
istex
hal-00291568v1
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Impact of local back biasing on performance in hybrid FDSOI/bulk high-k/metal gate low power (LP) technology
C. Fenouillet-Beranger
,
P. Perreau
,
T. Benoist
,
C. Richier
,
S. Haendler
et al.
Journal articles
hal-01002051v1
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PECVD of GeTe for next generation of non volatile memory
Corentin Vallée
,
L. Dussault
,
E. Despiau-Pujo
,
E. Gourvest
,
D. Jourde
et al.
18th International Colloquium on Plasma Processes (CIP), Jul 2011, rennes, France
Conference papers
hal-00925819v1
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Sidewall Modification of Porous SiOCH Induced by Etching and Post Etching Plasma Treatments
R. Bouyssou
,
T. Chevolleau
,
M. El Kodadi
,
M. Besacier
,
N. Possémé
et al.
3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France
Conference papers
hal-00625382v1
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(PE)ALD TaCN film nucleation and growth on TiNx: influence of nitrogen content
F. Piallat
,
R. Gassilloud
,
B. Pelissier
,
Cédric Leroux
,
P. Caubet
et al.
25th International Conference on Amorphous and Nano-crystalline Semiconductors, ICANS25, Aug 2013, Toronto, Canada
Conference papers
hal-00949998v1
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Wideband frequency and in-situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors
T. Bertaud
,
C. Bermond
,
T. Lacrevaz
,
Corentin Vallée
,
Y. Morand
et al.
18th Materials for Advanced Metallization Conference, Mar 2009, Grenoble, France
Conference papers
hal-00602814v1
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Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking
E. Eid
,
T. Lacrevaz
,
S. de Rivaz
,
C. Bermond
,
B. Fléchet
et al.
Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking, Sep 2009, San Francisco, United States
Conference papers
hal-00602866v1
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