Communication Dans Un Congrès Année : 2025

Dielectric cooling of a medium-voltage power module

Résumé

Semiconductor devices with voltage ratings of more than 3000 V are becoming more common, allowing for the development of power modules suited to Medium-voltage applications. From a packaging point-of-view, the challenge with such a power module is to address simultaneously the need for electrical insulation and the need for efficient removal of the heat dissipated by the semiconductor devices. A key concern of the study is that the silicon carbide (SiC) semiconductor power devices designed for voltages of 3 kV and more show a strong sensitivity to temperature. We demonstrate that although they can work at 175°C junction temperature, their performances (on-state resistance, mainly) are much better at Tj<100°C. Therefore, there is a need for a high-performance cooling system that is compatible with the medium-voltage isolation requirements. Here, we describe the design of such a power module, which is based on a liquid-cooled ceramic heatsink in which a dielectric fluid is circulated. A strong focus is placed on designing the ceramic heatsink to ensure that high power densities can be removed. A custom design relying on both jet impingement and channel flow is implemented to cool 3 SiC chips and their associated voltage balancing circuits. Experiments show that up to 367W/cm² (522W total) can be extracted at chip level with DeltaT=60K, and a very small temperature difference between the chips. The presentation will describe the specifications of the modules (in particular the need for low Tj operation), the design of the heatsink (including CFD simulations), and the experimental results (Rth and Zth measurements, IR Thermography, with different cooling conditions).

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Dates et versions

hal-05499560 , version 1 (08-02-2026)

Identifiants

  • HAL Id : hal-05499560 , version 1

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Cyril Buttay, Amin Salim Obaid Al-Hinaai, Till Huesgen, Hugo Reynes, Eric Vagnon, et al.. Dielectric cooling of a medium-voltage power module. Thermal 2025, IMAPS France, Mar 2025, La Rochelle, France. ⟨hal-05499560⟩
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