In the present study, microstructural evolution, mechanical and creep properties of Al/SiC/Cu composite strips fabricated via accumulative roll bonding (ARB) process were studied. The obtained results showed the formation of an atomic diffusion layer with thickness of about 17 mu m at the interface during the ARB under three creep loading conditions namely 30 MPa at 225 degrees C, 35 MPa at 225 degrees C, and 35 MPa at 275 degrees C. An generated intermetallic compound resulted in a 40% increase of interface thickness near Al. The stress level decreased by 13% at constant temperature with no significant effect on the interface thickness, and the creep failure time declined by 44%. It was observed that at constant temperatures, the second slope of the creep curve reached to 39% with increasing stress level, then, it dropped to 2% with a little temperature rising. After creep test under 35 MPa at 275 degrees C, the sample displays the presence of 60% Al and 40% Cu, containing brittle Al2Cu intermetallic compound at the interface. Applied temperature and stress had effect on the creep properties, specially increasing the slope of creep curves with higher stresses.