Thermomechanical modeling of copper-ceramic bonded assemblies for power electronics applications - Archive ouverte HAL
Rapport (Rapport Technique) Année : 2024

Thermomechanical modeling of copper-ceramic bonded assemblies for power electronics applications

Modélisation thermo-mécanique d'assemblage cuivre-ceramique en électronique de puissance

Résumé

This study examines the thermo-mechanical behaviour and reliability of Direct Bonded Copper (DBC) component in power electronics. Using finite element simulations and experimental data, material properties and interface behaviour has been modelled. Thermal cycling simulation has been done to identify key failure modes, focusing on stress distribution and crack propagation at the copper-ceramic interface. The findings offer crucial insights for improving the design and durability of DBC components in demanding applications.
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Dates et versions

hal-04682364 , version 1 (30-08-2024)

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Identifiants

  • HAL Id : hal-04682364 , version 1

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Théophile Hourdou. Thermomechanical modeling of copper-ceramic bonded assemblies for power electronics applications. Univ. Grenoble Alpes, CNRS, Grenoble INP, SIMaP, 38000 Grenoble, France. 2024. ⟨hal-04682364⟩
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