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Communication Dans Un Congrès Année : 2024

Automatic Generation of Thermal Models for PCB-based Power Electronics

Résumé

An automated workflow transforms the board design of a power converter circuit into a thermal equivalent-circuit model (TECM) that describes the thermal behaviour of power chips. It uses commercial software (Altium, ANSYS Icepak, LTSpice), with custom code handling data transfer and model preparation in between. Some systematic simplifications are proposed to speed up the calculation. This workflow is illustrated using an example case and the results are compared with experimental measurements (thermal impedance measurement).
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Dates et versions

hal-04534359 , version 1 (05-04-2024)

Identifiants

  • HAL Id : hal-04534359 , version 1

Citer

Bahaeddine Ben Hamed, Ahmed Sabry Eltaher Ahmed, Guillaume Lefevre, Rémi Perrin, Guillaume Regnat, et al.. Automatic Generation of Thermal Models for PCB-based Power Electronics. Conference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany. ⟨hal-04534359⟩
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