Simplified Stress Analysis of Multilayered Adhesively Bonded Metallic Structures - Archive ouverte HAL Access content directly
Conference Papers Year : 2019

Simplified Stress Analysis of Multilayered Adhesively Bonded Metallic Structures

Éric Paroissien
Frederic Lachaud
Abstract_AB2019_KubraSekmen.pdf (115.12 Ko) Télécharger le fichier
Origin : Files produced by the author(s)

Dates and versions

hal-04512332 , version 1 (20-03-2024)

Identifiers

  • HAL Id : hal-04512332 , version 1

Cite

Kübra Sekmen, Éric Paroissien, Frederic Lachaud. Simplified Stress Analysis of Multilayered Adhesively Bonded Metallic Structures. 5th International Conference on Structural Adhesive Bonding (AB2019), Jul 2019, Porto, Portugal. ⟨hal-04512332⟩
3 View
3 Download

Share

Gmail Facebook X LinkedIn More