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Communication Dans Un Congrès Année : 2021
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hal-04429330 , version 1 (12-03-2024)

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Tuyen-Duc Nguyen, Isaac Haik Dunn, Elyes Nefzaoui, Georges Hamaoui, Philippe Basset, et al.. Measurement and simulation of the three-dimensional temperature field in an RF SOI chip. 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2021, Berlin, Germany. pp.1-5, ⟨10.1109/THERMINIC52472.2021.9626402⟩. ⟨hal-04429330⟩
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