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Poster De Conférence Année : 2023

Micromachining and Packaging of Smart Probes for Sub-mmW on-Wafer Measurements

Résumé

In recent years, advanced silicon technologies are well-suited for designing integrated circuits optimized in G-band (140-220GHz). Validating these technologies requires the integration of active probes in functional packages, achieved by implementing the femtosecond laser micro-structuring technique, to extract transistor performance.
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Dates et versions

hal-04254742 , version 1 (23-10-2023)

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  • HAL Id : hal-04254742 , version 1

Citer

Maya Alawar, Victor Fiorese, Daniel Gloria, Guillaume Ducournau, Emmanuel Dubois. Micromachining and Packaging of Smart Probes for Sub-mmW on-Wafer Measurements. Journées Acoustique & Instrumentation, JAI2023 : evolution et applications, Journées Thématiques de la section Electronique du Club EEA, Oct 2023, Cergy - Paris, France. ⟨hal-04254742⟩
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