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Communication Dans Un Congrès Année : 2023

Fused filament fabrication: Numerical adhesion modeling suitable for semicrystalline polymers

Résumé

Abstract. Numerous studies have been conducted to improve the adhesion quality at the interface between the filaments which remains one of the weak points in the FFF process. The interfacial adhesion of printed parts has already been investigated by several authors for amorphous polymers. However, for semicrystalline polymers, the influence of crystallization on adhesion kinetics as well as the description of partial melting at interfaces between filaments are not well taken into account in the models describing FFF process. The purpose of this work consists of proposing a predictive multiphysics model that enables the prediction of the adhesion degree for semi-crystalline polymers during FFF process. The coupling of a crystallization and melting model allows the estimation of the crystalline degree evolution at the interface. The use of a recent model predicting the molecular mobility as a function of temperature and crystallization makes it possible to estimate the degree of healing in anisothermal conditions. Finally, a parametric study is performed in order to propose process window improving the adhesion quality.
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Dates et versions

hal-04120040 , version 1 (09-06-2023)

Identifiants

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Adel Benarbia, Vincent Sobotka, Nicolas Boyard, Christophe Roua. Fused filament fabrication: Numerical adhesion modeling suitable for semicrystalline polymers. 26th International ESAFORM Conference on Material Forming (ESAFORM 2023), Apr 2023, Krakow, Poland. pp.139-148, ⟨10.21741/9781644902479-16⟩. ⟨hal-04120040⟩
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