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Article Dans Une Revue COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering Année : 2020

Simulation of induction thermography NDT technique using SIBC

Résumé

Purpose This paper aims to present a lightened 3D finite element model (FEM) for coupled electromagnetic thermal simulation of the induction thermography non-destructive testing (NDT) technique to reduce the computation time. Design/methodology/approach The time harmonic electromagnetic problem is expressed in A – ϕ formulation and lightened by using the surface impedance boundary condition (SIBC) applied to both the massive induction coil surface and the surface of conductor workpiece including open cracks. The external circuit is taken into account by using the impressed voltage or the impressed current formulation. The thermal diffusion in the workpiece is solved by using surface electromagnetic power density as thermal source. Findings The accuracy and the usefulness of the method for the design of the induction thermography NDT technique have been shown with acceptable deviation compared with a full FEM model. It is also observed that at high frequency, when the ratio between the local radius of the conductor and the skin depth is high, a very good accuracy can be obtained with the SIBC methods. At lower frequency, the effect of the curvature of the surface becomes significant. In this case, the use of the Mitzner’s impedance can help to correct the error. Originality/value The SIBC can be used for both massive coil and workpieces with open cracks to alleviate 3D FEMs of the coupled electrothermal model. The implementation in matrix form of the coupled electrothermal formulation is given in details. The comparisons with reference analytical solution and full 3D FEM show the accuracy and performance of the method. In the test case presented, the computation time is 6.6 times lower than the classical model.
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Dates et versions

hal-04086607 , version 1 (11-04-2024)

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Abdoulaye Ba, Huu Kien Bui, Gerard Berthiau, Didier Trichet, Guillaume Wasselynck. Simulation of induction thermography NDT technique using SIBC. COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, 2020, 39 (5), pp.1071-1083. ⟨10.1108/COMPEL-01-2020-0007⟩. ⟨hal-04086607⟩
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