Comparison of Short-Circuit Failure "Ohmic Mode" of Epoxy Molded Package versus Silicone Gel Module for New Fail-Safe and Interruptible Power Converters - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2011

Comparison of Short-Circuit Failure "Ohmic Mode" of Epoxy Molded Package versus Silicone Gel Module for New Fail-Safe and Interruptible Power Converters

Frédéric Richardeau
Emmanuel Sarraute
Jean Marc Blaquière
Didier Flumian
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  • PersonId : 1174825
  • IdRef : 080022006

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Electronique
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Dates et versions

hal-03891964 , version 1 (09-12-2022)

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  • HAL Id : hal-03891964 , version 1

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Frédéric Richardeau, Zhifeng Dou, Emmanuel Sarraute, Jean Marc Blaquière, Vincent Bley, et al.. Comparison of Short-Circuit Failure "Ohmic Mode" of Epoxy Molded Package versus Silicone Gel Module for New Fail-Safe and Interruptible Power Converters. 21st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France, 2011, Bordeaux, France. ⟨hal-03891964⟩
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