Communication Dans Un Congrès Année : 2011

Comparison of Short-Circuit Failure "Ohmic Mode" of Epoxy Molded Package versus Silicone Gel Module for New Fail-Safe and Interruptible Power Converters

Domaines

Fichier non déposé

Dates et versions

hal-03891964 , version 1 (09-12-2022)

Identifiants

  • HAL Id : hal-03891964 , version 1

Citer

Frédéric Richardeau, Zhifeng Dou, Emmanuel Sarraute, Jean Marc Blaquière, Vincent Bley, et al.. Comparison of Short-Circuit Failure "Ohmic Mode" of Epoxy Molded Package versus Silicone Gel Module for New Fail-Safe and Interruptible Power Converters. 21st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France, 2011, Bordeaux, France. ⟨hal-03891964⟩
84 Consultations
0 Téléchargements

Partager

  • More