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Communication Dans Un Congrès Année : 2022

Interplay between ballistic confinement and thermal boundary resistance in sandwiched thin films and nano-junctions

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hal-03863472 , version 1 (21-11-2022)

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  • HAL Id : hal-03863472 , version 1

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Ali Alkurdi, Pierre-Olivier Chapuis. Interplay between ballistic confinement and thermal boundary resistance in sandwiched thin films and nano-junctions. Eurotherm 114: Nanoscale and Microscale Heat Transfer VII, May 2022, Palermo, Italy. ⟨hal-03863472⟩
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