Conference Papers
Year : 2020
Ayyoub ZOUAGHI : Connect in order to contact the contributor
https://hal.science/hal-03392227
Submitted on : Thursday, October 21, 2021-6:52:07 PM
Last modification on : Friday, March 24, 2023-2:53:23 PM
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- HAL Id : hal-03392227 , version 1
- DOI : 10.1109/CEIDP49254.2020.9437524
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Ouassim Agri, Eric Vagnon, Ayyoub Zouaghi, Jean-Louis Augé. Comparison of Different Insulating Liquids for PCB Embedded Power Modules. 2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩. ⟨hal-03392227⟩
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