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Conference Papers Year : 2020

Comparison of Different Insulating Liquids for PCB Embedded Power Modules

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hal-03392227 , version 1 (21-10-2021)

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Ouassim Agri, Eric Vagnon, Ayyoub Zouaghi, Jean-Louis Augé. Comparison of Different Insulating Liquids for PCB Embedded Power Modules. 2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩. ⟨hal-03392227⟩
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