Communication Dans Un Congrès Année : 2021

SIMULATION OF ADHESIVE FRICTIONAL CONTACT OF SOFT MATERIALS BY BI-POTENTIAL METHOD

Résumé

We propose a numerical formulation for the simulation of frictional contact with interfacial adhesion between soft bodies. In this work, the adhesive interface behaviour derives from a free surface energy and a pseudo-potential of the surface dissipation, which describe both the de-bonding process of the adhesive links due to tangential and normal interface deformation. Subsequently, a complete contact and friction law with the account for interface adhesion is formulated. Then the local contact nonlinear equations are solved using a Newton-like algorithm within the bi-potential framework. Numerical examples are performed to demonstrate the capacity of the proposed approach.

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Dates et versions

hal-03267975 , version 1 (22-06-2021)

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L. B Hu, Y. Cong, Z.-Q Feng. SIMULATION OF ADHESIVE FRICTIONAL CONTACT OF SOFT MATERIALS BY BI-POTENTIAL METHOD. 14th WCCM-ECCOMAS Congress, Jan 2021, Paris (virtuel), France. ⟨10.23967/wccm-eccomas.2020.206⟩. ⟨hal-03267975⟩
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