The elastic-plastic and low-cycle fatigue behaviors of copper films are studied experimentally and identified for further simulation works. A rolled annealed copper grade is considered here, as it is often used in flexible printed circuit boards for its mechanical resistance to high elongations. During operation, the printed circuit board (PCB) will undergo various loadings, whether purely mechanical or environmental. These loadings can lead to the fracture of copper and thus to the disconnection of the electrical signal in the PCB. Copper has a low yield stress, so it undergoes easily plastic deformation. In the present work, a predominant kinematic hardening has been observed experimentally and modeled with the combined hardening model of Lemaitre-Chaboche. The fatigue behavior has been identified on cyclic loadings at different strain amplitudes. A Coffin-Manson model has been adopted to reproduce experimental data. Identified behaviors have been introduced in a numerical simulation of a flexible PCB under cyclic bending/reverse bending, in order to estimate its mechanical reliability.