Model of mutual coupling between two bonding wires on glass substrate - HAL Accéder directement au contenu
Communication dans un congrès Année : 2013

Model of mutual coupling between two bonding wires on glass substrate

Résumé

This paper presents a simple model of mutual coupling between 2 bonding wires. The model has been compared to 3D full wave electromagnetic simulation up to 20 GHz. A good accordance was obtained.
Loading...
Fichier non déposé

Dates et versions

hal-02437447, version 1 (13-01-2020)

Identifiants

Citer

Thanh Vinh Dinh, Daniel Pasquet, Philippe Descamps, Dominique Lesenechal, Julien Pagazani, et al.. Model of mutual coupling between two bonding wires on glass substrate. 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG), Sep 2013, Dresden, Germany. pp.1-4, ⟨10.1109/ISCDG.2013.6656302⟩. ⟨hal-02437447⟩
46 Consultations
0 Téléchargements
Dernière date de mise à jour le 25/06/2024
comment ces indicateurs sont-ils produits

Altmetric

Partager

Gmail Facebook Twitter LinkedIn Plus