Sub-micron lines patterning into silica using water developable chitosan bioresist films for eco-friendly positive tone e-beam and UV lithography - Archive ouverte HAL Access content directly
Conference Papers Year : 2018

Sub-micron lines patterning into silica using water developable chitosan bioresist films for eco-friendly positive tone e-beam and UV lithography

Cédric Ray
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Christian Jonin
Yann Chevolot
Jean-Louis Leclercq

Abstract

Biopolymers represent natural, renewable and abundant materials. Their use is steadily growing in various areas (food, health, building …) but, in lithography, despite some works, resists, solvents and developers are still oil-based and hazardous chemicals. In this work, we replaced synthetic resist by chitosan, a natural, abundant and hydrophilic polysaccharide. High resolution sub-micron patterns were obtained through chitosan films as water developable, chemically unmodified, positive tone mask resist for an eco-friendly electron beam and deep-UV (193 nm) lithography process. Sub-micron patterns were also successfully obtained using a 248 nm photomasker thanks to the addition of bio-sourced photoactivator, riboflavin. Patterns were then transferred by plasma etching into silica even for high resolution patterns.
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hal-02019125 , version 1 (26-04-2019)

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Mathieu Caillau, Céline Chevalier, Pierre Cremillieu, Thierry Delair, Olivier Soppera, et al.. Sub-micron lines patterning into silica using water developable chitosan bioresist films for eco-friendly positive tone e-beam and UV lithography. SPIE Advanced Lithography, Feb 2018, San Jose, United States. pp.105870S, ⟨10.1117/12.2292312⟩. ⟨hal-02019125⟩
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