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Journal Articles Microelectronics Reliability Year : 2015

Thermomechanical modeling and simulation of a silicone gel for power electronic devices

Abstract

The aim of the study is to develop some nodal models describing thermomechanical link in power devices. It is focused on modeling, simulating and testing a component: the silicone gel used in power electronics modules. Due to the future availability of high temperature gel, this study is a first step to establish a multi-physic model. The study aims to establish fast and compact electro-thermomechanical model than can be connected to circuit models, representing other packaging components. In the first stage, a finite element model of a commercial gel is defined and some simulation results are presented. In the second stage, an equivalent “electrical” compact model is also suggested and compared to measurements and 3D simulation results. The results presented concern temperature dispatching in both, simulations and measurements, and averaged stresses as well as displacement within the silicone. Future works will describe the thermomechanical link in nodal models, as well as real environment surrounding the silicone gel. Indeed, the silicone thermal expansion impact will be monitored.
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Dates and versions

hal-01922534 , version 1 (14-11-2018)

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Marion Haussener, Simon Cailhol, Baptiste Trajin, Paul-Etienne Vidal, Francisco Javier Carrillo. Thermomechanical modeling and simulation of a silicone gel for power electronic devices. Microelectronics Reliability, 2015, 55, pp.2045-2049. ⟨10.1016/j.microrel.2015.06.116⟩. ⟨hal-01922534⟩
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