Develop and demonstrate an innova0ve, ultra-­‐compact, highly reliable and efficient power electronic converter with extended func0onali0es for aerospace applica0ons. ● Explore:-innova0ve 3D packaging and cooling concepts, by integra0on of full SiC power electronics (switches and diodes)-ultra-­‐compact passives and intelligent gate drive-novel control and health monitoring techniques with intelligent external communica0on.-reduc0on of cer0fica0on cost by modulariza0on and standardiza0on ● The key objec0ve:-3% increase in efficiency-Use of SiC and GaN components being able to cut the losses in power module by about 60%.-Increased switching frequency: further loss reduc0on in electric machines due to lower harmonic distor0on-Modular highly integrated power electronics building blocks ● Significant increase in power density:-2kW/kg today to at least 10kW/kg in given condi0ons and poten0ally 15kW/kg in more long term future-highly compact and flexible 3D design, integrated 3D packaging technologies-innova0ve cooling technology-cost effec0ve produc0on by new technologies Flex-­‐cover technology (Dynex) Microchannel heatsink technology (Siemens) Methodology for RUL (INSA)