Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing
Résumé
The modelization, fabrication and characterization of inductors using Molded Interconnect Device technology for multidirectional inductive proximity sensing is reported. Inductive proximity sensing allows contactless measurement of the position of electrically conductive objects. The principle of measurement relies on the use of an inductor which impedance is modified by the induced eddy currents at the surface of the conductive object. Inductors on LCP polymer are fabricated with MID technology, electroless metallization and electrodeposition of copper. 2D inductors are fabricated and characterized. Key parameter values are analyzed with a simplified model. Then proof of concept for 3D proximity sensing with a MID device is demonstrated.