Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing - Archive ouverte HAL
Communication Dans Un Congrès Année : 2016

Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing

Résumé

The modelization, fabrication and characterization of inductors using Molded Interconnect Device technology for multidirectional inductive proximity sensing is reported. Inductive proximity sensing allows contactless measurement of the position of electrically conductive objects. The principle of measurement relies on the use of an inductor which impedance is modified by the induced eddy currents at the surface of the conductive object. Inductors on LCP polymer are fabricated with MID technology, electroless metallization and electrodeposition of copper. 2D inductors are fabricated and characterized. Key parameter values are analyzed with a simplified model. Then proof of concept for 3D proximity sensing with a MID device is demonstrated.
Fichier non déposé

Dates et versions

hal-01409094 , version 1 (05-12-2016)

Identifiants

Citer

Sergkei Kamotesov, Philippe Lombard, Christian Vollaire, Vincent Semet, Michel Cabrera, et al.. Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing. MID, Sep 2016, Würzburg, Germany. 7738936 (6 p.), ⟨10.1109/ICMID.2016.7738936⟩. ⟨hal-01409094⟩
192 Consultations
0 Téléchargements

Altmetric

Partager

More