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Communication Dans Un Congrès Année : 2012

Development of high temperature packaging technologies for SiC power devices based on finite elements simulanation and experiments: thermal approach

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hal-00795337 , version 1 (27-02-2013)

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  • HAL Id : hal-00795337 , version 1

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Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Jean-Yves Delétage, Eric Woirgard. Development of high temperature packaging technologies for SiC power devices based on finite elements simulanation and experiments: thermal approach. 8th International Conference on Integration of Power Electronics Systems, Mar 2012, Nurember, Germany. pp.xx-xx. ⟨hal-00795337⟩
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