Chip on board 3-10 GHz Impulse Radio Ultra Wideband transmitter with optimized die to antenna wire bond transition - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology Année : 2013

Chip on board 3-10 GHz Impulse Radio Ultra Wideband transmitter with optimized die to antenna wire bond transition

Résumé

In this paper, a low power and low cost ultra wideband impulse radio transmitter is presented. The transmitter includes a pulse generator integrated in a 0.13- μm standard CMOS technology and an antenna printed on the chip carrier. The board is manufactured with Roger 4003 laminate substrate and has a total area of 50 mm × 18 mm. The transmitter provides 1.4 V peak to peak Federal Communications Commission compliant pulses at antenna input for data rates up to 36 Mb/s in an on-off keying modulation scheme. The transmitter's power consumption is 12 mW at 1.2-GHz pulse repetition frequency and the energy consumption is 10 pJ per pulse. A 365-mV peak voltage emitted pulse is measured in an anechoic room at 0.8 m range with a receiver, including a horn antenna (8.3 dBi), a LNA (32 dB), and a 12-GHz real time oscilloscope.
Fichier principal
Vignette du fichier
UWB_transmiter_advanced_packaging.pdf (1.24 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)

Dates et versions

hal-00779298 , version 1 (20-12-2021)

Identifiants

Citer

O. Fourquin, Sylvain Bourdel, Jean Gaubert, R. Vauche, N. Dehaese, et al.. Chip on board 3-10 GHz Impulse Radio Ultra Wideband transmitter with optimized die to antenna wire bond transition. IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, 2013, 3 (5), pp.749-758. ⟨10.1109/TCPMT.2012.2231466⟩. ⟨hal-00779298⟩
174 Consultations
72 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More