Communication Dans Un Congrès Année : 2011

Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization

Cyril Buttay
Jianfeng Li
Mihai Lazar
Christophe Raynaud
Hervé Morel

Résumé

Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature. In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process.

Fichier principal
Vignette du fichier
article.pdf (981.99 Ko) Télécharger le fichier
Origine Fichiers produits par l'(les) auteur(s)
Licence
Loading...

Dates et versions

hal-00672619 , version 1 (21-02-2012)

Licence

Identifiants

  • HAL Id : hal-00672619 , version 1

Citer

Cyril Buttay, Amandine Masson, Jianfeng Li, Mark C. Johnson, Mihai Lazar, et al.. Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization. HiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7. ⟨hal-00672619⟩
1181 Consultations
14793 Téléchargements

Partager

  • More