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Communication Dans Un Congrès ieee Année : 2011

Study of thermal interfaces aging for power electronics applications

Jean-Pierre Ousten
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Zoubir Khatir

Résumé

This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone 1500 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% decrease of initial thermal resistance.
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Dates et versions

hal-00628876 , version 1 (04-10-2011)

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  • HAL Id : hal-00628876 , version 1

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Jean-Pierre Ousten, Zoubir Khatir. Study of thermal interfaces aging for power electronics applications. EPE'11 ECCE Europe Power Electronics and Adjustable Speed Drives: Towards the 20-20-20 Target, Aug 2011, Birmingham, United Kingdom. pp.1 - 10. ⟨hal-00628876⟩
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