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Article Dans Une Revue Microelectronics Reliability Année : 2010

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing

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hal-00549513 , version 1 (22-12-2010)

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A. Aubert, J.P. Rebrassé, L. Dantas de Morais, N. Labat, H. Frémont. Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectronics Reliability, 2010, 50 (issues 9-11), pp.1688-1691. ⟨10.1016/j.microrel.2010.07.036⟩. ⟨hal-00549513⟩
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