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Article Dans Une Revue Microelectronics Reliability Année : 2009

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

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hal-00414780 , version 1 (10-09-2009)

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  • HAL Id : hal-00414780 , version 1

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Alexandre Micol, Adrien Zéanh, Tony Lhommeau, Stephane Azzopardi, Eric Woirgard, et al.. An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectronics Reliability, 2009, 49, pp.1370-1374. ⟨hal-00414780⟩
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