Journal Articles
Microelectronics Reliability
Year : 2009
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https://hal.science/hal-00414780
Submitted on : Thursday, September 10, 2009-2:28:07 AM
Last modification on : Tuesday, September 23, 2025-2:22:13 PM
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- HAL Id : hal-00414780 , version 1
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Alexandre Micol, Adrien Zéanh, Tony Lhommeau, Stephane Azzopardi, Eric Woirgard, et al.. An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectronics Reliability, 2009, 49, pp.1370-1374. ⟨hal-00414780⟩
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