Deposition of TiO2 thin films by atmospheric plasma post-discharge assisted injection MOCVD
Résumé
TiO2 thin films have been deposited at low temperature using a new atmospheric pressure deposition process, which combines remote Atmospheric Pressure (AP) Plasma with Pulsed Injection Metallorganic Chemical Vapour Deposition (PIMOCVD). The effects of post-discharge plasma and deposition parameters have been studied with respect to the deposition kinetics, morphology, and microstructure of TiO2 films. It is shown that well-crystallised TiO2 anatase films can be obtained at a temperature of only 275°C.
Domaines
MatériauxOrigine | Fichiers produits par l'(les) auteur(s) |
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