Evolution of Cu microstructure and resistivity during thermal treatment of damascene line: Influence of line width and temperature - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Microelectronic Engineering Année : 2007
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hal-00207489 , version 1 (17-01-2008)

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  • HAL Id : hal-00207489 , version 1

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V. Carreau, S. Maitrejean, M. Verdier, Y. Brechet, A. Roule, et al.. Evolution of Cu microstructure and resistivity during thermal treatment of damascene line: Influence of line width and temperature. Microelectronic Engineering, 2007, pp.51. ⟨hal-00207489⟩
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