Experimental Analysis of Punch-Through Conditions in Power P-I-N Diodes - Archive ouverte HAL
Article Dans Une Revue IEEE Transactions on Power Electronics Année : 2007

Experimental Analysis of Punch-Through Conditions in Power P-I-N Diodes

Tarek Ben Salah
  • Fonction : Auteur
  • PersonId : 838647
Cyril Buttay
Bruno Allard
Hervé Morel

Résumé

Commercial power diodes are optimized to feature punch–through behavior. However, a tradeoff between the width and the doping level of the diode epitaxial layer leads to various levels of optimization. For a given breakdown voltage, a shorter epitaxial layer width leads to better transient performances. Device datasheets do not cover this issue and a simple experimental setup is presented to assess the optimization conditions inside the diode epitaxial layer. Three commercial devices are tested and experimental results are confronted to device simulations. A good agreement is found
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Dates et versions

hal-00135198 , version 1 (07-03-2007)

Identifiants

Citer

Tarek Ben Salah, Cyril Buttay, Bruno Allard, Hervé Morel, Sami Ghedira, et al.. Experimental Analysis of Punch-Through Conditions in Power P-I-N Diodes. IEEE Transactions on Power Electronics, 2007, 22 (1), pp.13-20. ⟨10.1109/TPEL.2006.886648⟩. ⟨hal-00135198⟩
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