Data-driven model to derive air-cooled heat sinks mass for power electronics
Résumé
This paper reports a new data-driven approach to model air-cooled heat sinks for active devices such as power modules or discrete package. Analysis of hundreds of references from several manufacturers allowed the establishment of new empirical relations between mass and thermal resistance of heatsinks. This work differs from previous contributions in heat sink modelling by the use of "real-world" (product driven) data to directly find relations, without the use of simulation software or analytic models. These relations can be used in electronics, and particularly in power electronics to derive the mass of a heat sink from its thermal properties. It is useful to the designer who wants to design and optimize the power densities of a power converter, or to determine the bill of material and/or its associated environmental impacts.
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