Communication Dans Un Congrès Année : 2025

Ultrasonic maging of layer on substrate structures using high-frequency acoustic field correlation

Résumé

Layer on substrate structures are often subject to various types of defects, particularly those resulting from manufacturing process during thin-film growth. Currently, one method of inspecting such structures involves the use of IDT transducers for excitation and laser vibrometry for reception. In this work, we propose a complementary approach inspired by passive noise correlation imaging methods initially developed in geophysics. This technique is applied here to image layered structures on substrates by exploiting the correlation of diffuse acoustic waves and the associated principle of passive Green’s function reconstruction, enabling the detection and imaging of defects. The analysis was performed using numerical simulations and preliminary experiments on silicon wafers (3 mm thick). IDTs (10-25) MHz were used to generate surface waves, and the resulting displacement field was captured using laser vibrometry. Simulations and measurements were carried out on both defect-free and defectcontaining cases. Correlation matrices were calculated on Full Matrix Capture mode. Finally, a beamforming algorithm was applied to localize defects, taking into account silicon’s anisotropy.

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Dates et versions

hal-05378591 , version 1 (23-11-2025)

Identifiants

  • HAL Id : hal-05378591 , version 1

Citer

Nada Ben Jafela, Lynda Chehami, Marc Duquennoy, Emmanuel Moulin, Nikolay Smagin, et al.. Ultrasonic maging of layer on substrate structures using high-frequency acoustic field correlation. Forum Acusticum 2025, EAA, Jun 2025, Malaga, Spain. ⟨hal-05378591⟩
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