Effect of solder type on joint performance between ReBCO tapes
Résumé
The fabrication of low-resistance, mechanically robust joints between ReBCO-coated conductors (CCs) remains a key challenge in the development of high-field superconducting magnets due to the complexity of these tapes. Although soldering is a widely used method for joining CCs, issues such as thermal stress, high processing temperatures, and tape brittleness demand precise control of manufacturing conditions. In this study, the effect of solder type (binary, Pb-free, and ternary systems), as one of the processing parameters, on the electrical and mechanical properties of soldered lap joints between YBCO tapes was examined. In this regard, the joint’s electrical performance was evaluated using the standard four-probe method. The mechanical strength of the joint was also assessed via axial tensile testing. The choice of solder was found to have a substantial impact on joint performance; PbSn and InBi produced the most favorable results. These findings provide valuable insights into optimizing joint fabrication techniques for improved performance in practical superconducting applications.