Innovative Ni-Al2O3 substrate including a graded interface fabricated by SPS: Application for power modules
Substrat innovant de Ni-Al2O3 comprenant une interface gradée fabriqué par SPS : application pour les modules de puissance
Résumé
To enhance the efficiency of power modules, the development of new substrate technologies is essential. This article describes the design of a nickel-alumina substrate produced through co-sintering via spark plasma sintering (SPS), utilizing a sacrificial alumina layer approach. An Ni-Al2O3 substrate is achieved after sintering at 1150 °C under a pressure of 50 MPa. The substrate has two thick nickel metal layers, making it suitable for applications with high current densities. A well-defined interface, of thickness 30–40 μm, is formed. It consists solely of pure nickel and pure alumina with no secondary phases. The mechanism behind the formation of this interface is attributed to thermomechanical deformation during the sintering process. Mechanical tests, including shear and pull tests, demonstrate adhesion strength that meets aeronautical standards. This one-step approach, which saves both energy and time, can be applied across various fields utilizing technical ceramics.
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