Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications
Résumé
1. B55X: A SHIFT in STMicroelectronics BiCMOS Technologies 1
P. Chevalier, Member, IEEE, A. Gauthier, N. Guitard, V. Milon, F. Monsieur, N. Derrier, C. Deglise-Favre, D. Céli, C. Durand, O. Foissey, F. Sonnerat, F. Gianesello, D. Gloria
2. RF Technology Roadmap for 5G and 6G RF Front-end Systems 13
Yvan Morandini
3. Advanced Substrate Technologies for Sub-THz Era 21
François Brunier
4. A CMOS Compatible III-V-on-300 mm Si Technology for Future High-speed Communication Systems: Challenges and Possibilities 27
A. Vais, A. Kumar, G. Boccardi, S. Yadav, Y. Mols, R. Alcotte, B. Vermeersch, M. Ingels, U. Peralagu, C. Roda Neve, B. Ghyselen,
B. Parvais, P. Wambacq, B. Kunert, and N. Collaert
5. The Impact of Irradiation on DC Characteristics and Low-Frequency Noise of Advanced SiGe:C HBTs 41
B. Sagnes, A. Adebabay Belie, M. Bouhouche, J. El Beyrouthy, F. Pascal, J. Boch, P. Chevalier, and D. Gloria
6. D-band Modulated Signal Generation using Photonics Techniques 53
Y. M. Wodaje, B. Baridi, O. Occello, F. Danneville, P. Szriftgiser, and G. Ducournau
7. Decarbonizing the Electronics Industry to Achieve Net Zero (2024) 59
Gunther Walden
8. Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital−Analog Converters in Coherent Optical Transmission Systems 67
Oliver Hauck, Fred Buchali, Michael Collisi, and Michael Möller
9. Challenges for 2.5D and 3D Integration of InP HBT Technology 81
Bertrand Ardouin, Tom K. Johansen, Antoine Chauvet, Romain Hersent, Virginie Nodjiadjim, Agnieszka Konczykowska, Nil Davy, Muriel Riet and Colin Mismer
10. Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method 91
Hiroaki Takahashi, Pelin Suealp, and Erich Schlaffer 11. D-band Phased Array Antenna Module for 5G Backhaul 101
A. Fonte, S. Moscato, R. Moro, A. Pallotta, A. Mazzanti, A. Bilato, G. De Filippi, L. Piotto, F. Centurelli, P. Monsurrò, H. Sadeghi Chameh, P. Tommasino, A. Trifiletti, D. Lodi Rizzini, F. Tesolin, S. M. Dartizio, and S. Levantino
12. Sub-THz Transceiver Design for Future Generation Mobile Communications 115
G. Mangraviti, C. Dehos, V. Puyal, O. Richard, G. Yaakoubi khbiza, F. Foglia Manzillo, X. V. L. Nguyen, F. Filice, E. Noccetti, P. L. Hellier, F. Podevin, S. Bourdel, A. Ruffino, K.-S. Choi, B. Abdelaziz Abdelmagid, M. Eleraky, H. Wang, B. Ardouin, T. K. Johansen, L. Fanori, Q. Huang, E. Schlaffer, P. Wambacq, D. Morche, and B. Debaillie
13. Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array 133
Francesco Manni, Paolo Colantonio, Rocco Giofrè, Ernesto Limiti, Patrick Ettore Longhi, Steven Caicedo Mejillones, Stefano Moscato, and Alessandro Fonte
14. InP on Si Technologies for Next-Generation Optical Communication High-speed Analog Front-Ends 145
Romain Hersent
15. 150 nm Gallium Nitride on Silicon Carbide Technology for High-power 5G New Radio Applications 149
Kimon Vivien
16. Post-process Substrate Porosification for RF Applications 151
Joff Derluyn
17. A Multi-standard RF Bandpass Sigma-Delta ADC 153
Hassan Aboushady
18. D-band RF Architecture for Beyond 5G Wireless Networks: Specifications, Challenges, and Key Enabling Technologies 155
Cedric Dehos
19. E-band and D-band VCOs: Distributed Tank Design Methodology, Bufferless Approach 157
Leonardo Gomes
20. 2.5D, 3D Assembly Technologies for RF, mmW and Sub-THz Heterogeneous Systems 159
Valorge Olivier
21. Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond 163
Hady Yacoub
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