In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Journal of Electronic Materials Année : 2022

In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint

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hal-04457659 , version 1 (14-02-2024)

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L. Cornet, L. Yedra, É. Héripré, V. Aubin, J.-H. Schmitt, et al.. In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint. Journal of Electronic Materials, 2022, 51 (4), pp.1568-1582. ⟨10.1007/s11664-021-09390-w⟩. ⟨hal-04457659⟩
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