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Communication Dans Un Congrès Année : 2019

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

Résumé

We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator.
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Dates et versions

hal-04392754 , version 1 (14-01-2024)

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Perceval Coudrain, P. Chausse, L. Arnaud, D. Lattard, E. Guthmuller, et al.. Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), May 2019, Las Vegas, France. pp.569-578, ⟨10.1109/ECTC.2019.00092⟩. ⟨hal-04392754⟩

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