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Communication Dans Un Congrès Année : 2023

RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz

Résumé

In this paper, passive devices integrated in the top-tier level of a 3D homogeneous integration are characterized up to 220 GHz. A three steps de-embedding process is performed to remove 1.5 mm access line and 25μm vertical Cu-pillars parasitic contribution. This process will enable to separate the technology from the millimeter-wave measurement. To validate the technique two different devices: a transmission line and an inductor are studied and compared to stand-alone planar reference device at sub-THz.
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Dates et versions

hal-04370209 , version 1 (02-01-2024)

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Citer

A. Oliveira, O. Valorge, C. Dubarry, Y. Roelens, M. Zaknoune, et al.. RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz. 2023 53rd European Microwave Conference (EuMC), Sep 2023, Berlin, Germany. pp.616-619, ⟨10.23919/EuMC58039.2023.10290293⟩. ⟨hal-04370209⟩
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